Hot Melt Adhesive ku byuma ebikozesebwa mu byuma bikalimagezi

Model TH-703, Hot Melt Adhesive for Electronics ye adhesive enjeru ennongoofu-enyweza PCBs, waya tacks ne housings mu sikonda nga kikola enfuufu- ne splash-proof seal. Its 110℃softening point stays rigid inside appliances operating up to 75℃, kale bondi tezijja kwekulukuunya wansi w’ebbugumu lya tulansifooma oba okukankana kwa mmotoka. Ekoleddwa mu biwujjo ebirimu haidrojeni n’emmere-grade EVA, enkola ya ultra-low-VOC eyamba amakolero okuyita mu kubala ebitabo bya REACH, RoHS n’empewo ey’omunda awatali kuyingiza mpewo kwongera.

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Hot Melt Adhesive for Electronics yakolebwa naddala ku bintu ebyeru-ebyamaguzi, amaanyi-ekikozesebwa, LED-driver n'abakola ebyuma ebitono-ebyetaaga okukuŋŋaanyizibwa amangu, ennyonjo nga bigattiddwa wamu n'okukuuma obutonde bw'ensi okumala ebbanga eddene. Ekyesiiga kifuluma bulungi ku diguli 150-170 nga kiyita mu mmundu za ggaamu eza mm 11 oba emitwe egy’okugaba micro-, ne kifukirira ABS, PC, PP, aluminiyamu n’ekikomo awatali kukulukuta oba okufuumuuka. Mu sikonda 3-6 ekiyungo kinnyogoga okutuuka ku pulasitiika ey’ebbugumu enkalu, enjeru, etali ya kyenvu egaba amaanyi g’okusala 3.5 MPa ku biyungo bya ABS/ABS era n’eyita 1000 h ku 70℃/85 % RH awatali kukendeeza ku buzito oba okwatika.

A precisely tuned 110℃Ring-&-Ball softening point ekuuma polimeeri nga nnywevu mu kiseera ky'ekyuma ekya bulijjo okwebugumya, naye ate kisobozesa okukozesa ebbugumu eritono-okukuuma ebbugumu-ebitundu ebiwulikika nga SMD capacitors ne thin-bbuvela. Oluvannyuma lw’okuteekebwa, ekyesiiga kikola firimu eziyiza amazzi-obutasalako etuuka ku kusiba enfuufu-ku misonno gy’ebizimbe, okuyingira kw’emiguwa n’okuteeka ebiyungu-empenda za PCB ezitaliimu, ekisala obwetaavu bwa gaasikiti za silikoni oba epokisi ez’ebitundu bibiri-. Hydrogenated tackifying resins ziggyawo unsaturated double bonds, ne zivaamu VOC emissions wansi wa 50 μg g−1 (EU ISO 16000-6) n’emiwendo gy’akawoowo egitazuulibwa ku mm 50 ebanga, okuyamba layini z’okufulumya okutuukiriza omutindo gwa LEED, WELL ne BSCI ogw’empewo ey’omunda.

Enkola eno 100 % terimu halogen, antimony, ebyuma ebizito, phthalates ne formaldehyde, nga egoberera RoHS 2.0, REACH SVHC 240. Okugezesebwa kw’obuziyiza kulaga 3.8 × 1015 Ω cm volume resistivity ne 520 V/mil dielectric strength, ekifuula cured adhesive safe around 230 V circuits and LED ensonga za solder. Omuggo guno ogwokya-okusaanuuka gukwata ebitundu mangu, gusiba obunnyogovu n’enfuufu, guwona ebbugumu ly’ebyuma ebikola era gukuuma wansi w’omulimu nga kiragala, Hot Melt Adhesive for Electronics egaba eky’okugonjoola ekyetegefu-okukozesebwa, ekikekkereza ssente-ekiyita mu buli kubala ebiragiro by’okugoberera.

Amawulire agakwata ku bikozesebwa

ENNAMBA YA MODEL	TH-703	BULANDI	Tianze
FOOMU	Akati	OBUNENE	11.2 * 300mm
ERANGI	Kyeeru	EBIKOLWA EBIKULU	EVA
EKITUNDU EKYOKUGOnza	105-115 diguli	OBUVUNANYIZIBWA @170diguli	Waggulu
OBUDDE BW'OKUGGULAWO	Midiyamu	OKUTEEKAWO OBUDDE	Okusiiba
OKUPAKIRIZA	20kg/ekibokisi	OKULEGAKO	Sampuli ya bwereere eriwo

Q&A

Q: Omuggo guno ogwa kalaamu gusobola okukozesebwa ku kintu eky’ebyuma kyokka?

A: Nedda, ekika kino eky’omuggo gwa kalaamu tekikoma ku kukola ku bintu bya byuma bikalimagezi byokka, wabula era kisobola okukozesebwa mu makolero amalala ng’amakolero g’okupakinga.

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