Enyanjula Ku Polyamide Hot Melt Adhesives

Polyamide hot melt adhesive, era emanyiddwa nga dimer acid polyamide hot melt adhesive, kintu kya polimeeri ekikolebwa okuva mu diacid ne diamines okuyita mu copolymerization reaction, n’oluvannyuma ne kikolebwa okuyita mu kukyusa n’okufuumuula. Enteekateeka yaayo yeesigamiziddwa ku kusengejja kwa asidi za dimer ne polyamines mu bbugumu eringi-, era egabanyizibwamu ebika bibiri: obuzito bwa molekyu obw’amaanyi (okukulukuta obulungi, okugumira okuyonja mu nkalu) n’obuzito bwa molekyu obutono (amaanyi n’obugumu obusinga EVA). Kikozesebwa nnyo mu kusiba emifaliso, amaliba, ebyuma, ne seramiki, awamu n’okukuuma ebitundu by’ebyuma n’okusiba ebitabo.

Ekintu kino kirina obuwanvu bw’okugonvuwa okuva ku diguli 100 okutuuka waggulu wa diguli 200 , okugumiikiriza ebbugumu okuva ku -diguli 40 okutuuka ku diguli 200 , n’obuzito obw’enjawulo nga 0.97 ku bbugumu erya bulijjo. Langi yaayo enkulu ye ya amber, esobola okutereezebwa okutuuka ku langi enjeru, enjeru oba endala ng’ossaamu kaboni omuddugavu, titanium dioxide n’ebirala.Ekintu ekisookerwako ekya polyamine kirina okuterekebwa mu bipapula ebitayingiramu mazzi. Kiteekwa okukozesebwa awamu n’ekyuma ekisiiga ebisaanuusa mu bbugumu, era ebyuma birina okuyonjebwa buli kiseera okuziyiza kaboni n’okuzibikira mu bbugumu eringi.