Enkola y’okuteekateeka ebizigo bya polyamide
Leka obubaka .
Okuteekateeka Dimeric Linoleic Acid: Linoleic acid, ebbumba, lithium carbonate, n’amazzi byagattibwa mu riyakita ne bitabulwa ku puleesa ya 0.8–1.2 MPa. Ebbugumu lyalinnyisibwa okutuuka ku diguli 230 ne likwatagana okumala essaawa 5. Oluvannyuma omutabula gwanyogozebwa okutuuka ku diguli 100 , era ne guteekebwamu g 1.92 ez’amazzi aga asidi wa phosphoric. Olwo puleesa yakendeezebwa okutuuka ku 0.3–0.5 MPa, era ebbugumu ne lirinnyisibwa okutuuka ku diguli 150 okumala essaawa emu. Mu nkomerero, ebbugumu lyakka okutuuka ku diguli 100 , era omutabula ne gusengejebwa nga gwokya okuggyawo ekirungo ekiziyiza okuzimba. Oluvannyuma asidi z’amasavu ezitali za polimeeri zafuumuulwa wansi w’obuziba obw’amaanyi (6.7–10.7 Pa) ku diguli 220–225 okufuna asidi wa linoleic ow’obulongoofu obwa waggulu-dimerized.
Okuteekateeka Polyamide Hot Melt Adhesive: Wansi w’obukuumi bwa nayitrojeni, omutabula gwa ethylenediamine ne hexamethylenediamine gwateekebwamu mpola amatondo nga bwe gusika n’okubugumya omutabula okutuuka ku diguli 130 . Mu kiseera kino, ebbugumu lifugibwa ku diguli 140–150 . Oluvannyuma lw’okugattako okuggwa, ebbugumu lirinnyisibwa okutuuka ku diguli 205–220 era ensengekera egenda mu maaso okutuusa ng’amazzi agali mu kivaamu gasemberera omuwendo gw’enzikiriziganya. Olwo, puleesa ekendeezebwa, era enzirukanya n’egenda mu maaso okumala essaawa endala ku 1.3–2.7 kPa ne 220–230℃. Mu kusembayo, sampuli etwalibwa okuzuula omuwendo gwa amine. Singa etuukana n’omuwendo (nga 10), ekintu kisobola okunyogozebwa ne kifulumizibwa. Ekifo ekigonvuwa eky’ekyesiiga ekisaanuuse eky’ebbugumu kyawukana okusinziira ku bungi bwa asidi wa dilinoleic, asidi wa sebacic, ethylenediamine, ne hexamethylenediamine ebikozesebwa.
